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Isolated Solid-State Packaging Technology of High-Temperature Pressure Sensor(PDF)

Transactions of Tianjin University[ISSN:1006-4982/CN:12-1248/T]

Issue:
2003年04期
Page:
264-268
Publishing date:

Info

Title:
Isolated Solid-State Packaging Technology of High-Temperature Pressure Sensor
Author(s):
ZHANG Sheng-cai JIN Peng YAO Su-ying ZHAO Yi-qiang QU Hong-wei
(School of Electronic Information Engineering, Tianjin University, Tianjin 300072, China)
Keywords:
DOI:

Abstract:
The principle of miniature isolated solid-state encapsulation technology of high-temperature pressure sensor and the structure of packaging are discussed, including static electricity bonding, stainless steel diaphragm selection and rippled design, laser welding, silicon oil infilling, isolation and other techniques used in sensor packaging, which can affect the performance of the sensor. By adopting stainless steel diaphragm and high-temperature silicon oil as isolation materials, not only the encapsulation of the sensor is as small as 15 mm in diameter and under 1 mA drive, its full range output is 72 mV and zero stability is 0.48% F.S/mon, but also the reliability of the sensor is improved and its application is widely broadened.

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Last Update: 2011-05-02