|本期目录/Table of Contents|

[1]陈金星,李 君,李擎擎.多孔介质微燃烧器的稳燃范围的数值研究[J].燃烧科学与技术,2017,(03):231-235.[doi:DOI 10.11715/rskxjs.R201605033]
 Chen Jinxing,Li Jun,Li Qingqing.Numerical Study on Stability Limits of Combustionin Micro-Combustors with Porous Medium[J].Journal of Combustion Science and Technology,2017,(03):231-235.[doi:DOI 10.11715/rskxjs.R201605033]
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多孔介质微燃烧器的稳燃范围的数值研究()
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《燃烧科学与技术》[ISSN:1006-8740/CN:12-1240/TK]

卷:
期数:
2017年03
页码:
231-235
栏目:
出版日期:
2017-06-15

文章信息/Info

Title:
Numerical Study on Stability Limits of Combustion in Micro-Combustors with Porous Medium
作者:
陈金星李 君李擎擎
天津大学机械工程学院,天津 300350
Author(s):
Chen JinxingLi JunLi Qingqing
School of Mechanical Engineering,Tianjin University,Tianjin 300072,Chin
关键词:
微平板燃烧器多孔介质稳燃范围数值模拟
Keywords:
planar micro-combustorporous mediumstability limitsnumerical simulation
分类号:
TK16
DOI:
DOI 10.11715/rskxjs.R201605033
文献标志码:
A
摘要:
应用计算流体力学软件 Fluent,对氢气/空气预混气在部分填充多孔介质的微平板燃烧器中的实验现象进 行了模拟,研究了多孔介质热导率、壁面热导率、多孔介质孔隙率对稳燃范围的影响.模拟结果表明:稳燃范围 的大小与多孔介质热导率呈正相关趋势,较高的多孔介质热导率将会拓宽稳燃范围;随着壁面热导率的增加,稳 燃范围与壁面热导率呈 V 型比例;多孔介质孔隙率也是影响稳燃范围的一个重要因素,在 0.5~0.9 的区间内, 随着孔隙率的增大,稳燃范围也随之增大.
Abstract:
Based on the experimental phenomena of premixed hydrogen/air combustion in planar microcombustors partially filled with porous medium,numerical study was carried out to examine the influence of porous medium thermal conductivity,wall thermal conductivity,and porosity on stability limits,using computational fluid dynamics software Fluent.The results show that stability limits have a positive correlation with porous medium thermal conductivity,and higher porous medium thermal conductivity will broaden stability limits.With the increase of wall thermal conductivity,stability limits will exhibit a V-shaped pattern against it.Porosity is also an important factor influencing stability limits.Within the range of 0.5 to 0.9,stability limits will expand gradually with the increase of porosity.

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备注/Memo

备注/Memo:
收稿日期:2016-05-20. 基金项目:国家自然科学基金资助项目(51306129). 作者简介:陈金星(1991— ),男,硕士,chenjinxing@tju.edu.cn. 通讯作者:李 君,男,博士,副教授,lijun79@tju.edu.cn.
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