|本期目录/Table of Contents|

Research on the process of fabricating a multi-layer metal micro-structure based on UV-LIGA overlay technology(PDF)

《纳米技术与精密工程》[ISSN:1672-6030/CN:12-1351/O3]

期数:
2019年2期
页码:
83-88
栏目:
出版日期:
2019-06-15

文章信息/Info

Title:
 Research on the process of fabricating a multi-layer metal micro-structure based on UV-LIGA overlay technology
作者:
Yali Ma a Wenkai Liu a* Chong Liu b
a Department of Military Materials Distribution, Army Military Transportation University, Tianjin 300161, China
b School of Mechanical Engineering, Dalian University of Technology, Dalian 116023, China
Author(s):
 Yali Ma a Wenkai Liu a* Chong Liu b
关键词:
UV-LIGA overlay technology
SU-8 photoresist
Micro-electroforming technology
Multi-layer metal micro-structure
Keywords:
-
分类号:
-
DOI:
-
文献标识码:
A
摘要:
In this paper, we report the study of the process of fabricating a multi-layer metal micro-structure using UV-LIGA overlay technology, including mask fabrication, substrate treatment, and UV-LIGA overlay processes. To solve the process problems in the masking procedure, the swelling problem of the fi rst layer of SU-8 thick photoresist was studied experimentally. The 5 μ m line-width compensation and closed 20 μ m and 30 μ m isolation strips were designed and fabricated around the micro-structure pattern. The pore problem in the Ni micro-electroforming layer was analyzed and the electroforming parameters were improved. The pH value of the electroforming solution should be controlled between 3.8 and 4.4 and the current density should be below 3 A/dm 2 . To solve the problems of high inner stress and incomplete development of the micro-cylinder hole array with a diameter of 30 μ m, the lithography process was optimized. The pre-baking temperature was increased via gradient heating and rose every 5 °C from 65 °C to 85 °C and then remained at 85 °C for 50 min 1 h. In addition, the full contact exposure was used. Finally, a multi-layer metal micro-structure with high precision and good quality of microelectroforming layer was fabricated using UV-LIGA overlay technology.
Abstract:

参考文献/References

备注/Memo

备注/Memo:
Corresponding author.
E-mail address: lwk2003188@163.com (W. Liu).
更新日期/Last Update: 2019-10-20