|本期目录/Table of Contents|

Au maskless patterning for vacuum packaging using the electrochemical method(PDF)

《纳米技术与精密工程》[ISSN:1672-6030/CN:12-1351/O3]

期数:
2018年3期
页码:
191-196
栏目:
出版日期:
2018-09-15

文章信息/Info

Title:
 Au maskless patterning for vacuum packaging using the electrochemical method
作者:
Bo Xie* Deyong Chen JunboWang Jian Chen Wen Hong
Author(s):
 Bo Xie* Deyong Chen JunboWang Jian Chen Wen Hong
 Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
关键词:
-
Keywords:
Vacuum packaging
Wire interconnection
Selective gold etching
Maskless pattern
Highly uneven surface
Electrochemical etching
分类号:
-
DOI:
-
文献标识码:
A
摘要:
-
Abstract:
The interconnection ofwires is an important issue in vacuum-packaged microelectromechanical systems devices
because of the difficulties of hermetical sealing and electrical insulation. This paper presents an approach of Au
film selective patterning on highly uneven surfaces for wire interconnections of devices in which silicon-oninsulator
(SOI) wafers are anodically bonded to glass. The Au film on the handle layer, functioned as an anode,
was selectively removed with electrochemical dissolution in a chloride solution. The choice of etchant solution
and etching conditions were optimized to improve the process efficiency, resulting in a high yield of gold portions
within the via holes for wire interconnection. The proposed wire interconnection technology was employed to
fabricate a vacuum-packaged resonant pressure sensor as a proof-of-concept demonstration. Reliablewire bonding
and vacuum package were achieved as well as a Q factor that does not decrease over a year. As a platform
technology, this method provides a new approach of wire interconnection for vacuum-packaged devices based
on SOI–glass anodic bonding.

参考文献/References

-

备注/Memo

备注/Memo:
 *Corresponding author.
E-mail address: xiebo11@mails.ucas.ac.cn (B. Xie).
https://doi.org/10.1016/j.npe.2018.09.001
1672-6030/? 2018 Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
更新日期/Last Update: 2018-12-27