|本期目录/Table of Contents|

 Finite element simulation of the micromachining of nanosized-silicon-carbide-particle reinforced composite materials based on the cohesive zone model(PDF)

《纳米技术与精密工程》[ISSN:1672-6030/CN:12-1351/O3]

期数:
2018年4期
页码:
242-247
栏目:
出版日期:
2018-12-15

文章信息/Info

Title:
 Finite element simulation of the micromachining of nanosized-silicon-carbide-particle reinforced composite materials based on the cohesive zone model
作者:
 Hongmin Pen a Jianhua Guo b Zizhen Cao a Xianchong Wang a Zhiguo Wang c
a Tianjin Institute of Aerospace Mechanical and Electrical Equipment, Tianjin 300458, China
b Tianjin Long March Technical Equipment Co. Ltd., Tianjin 300462, China
c Guilin University of Aerospace Technology, Guilin 541000, China
Author(s):
-
关键词:
 Multiscale  Cohesive zone model  Nanosized silicon carbide particles  Composite materials Micromachining
Keywords:
-
分类号:
-
DOI:
-
文献标识码:
A
摘要:
 A finite element method based on the cohesive zone model was used to study the micromachining process of nanosized silicon-carbide-particle (SiCp) reinforced aluminum matrix composites. As a hierarchical multiscale simulation method, the parameters for the cohesive zone model were obtained from the stress-displacement curves of the molecular dynamics simulation. The model considers the random properties of the silicon-carbide-particle distribution and the interface of bonding between the silicon carbide particles and the matrix. The machining mechanics was analyzed according to the chip morphology, stress distribution, cutting temperature, and cutting force. The simulation results revealed that the random distribution of nanosized SiCp causes non-uniform interaction between the tool and the reinforcement particles. This deformation mechanics leads to inhomogeneous stress distribution and irregular cutting force variation.
Abstract:

参考文献/References

备注/Memo

备注/Memo:
 Corresponding author.
E-mail address: hmpen23@126.com (H. Pen).
https://doi.org/10.1016/j.npe.2018.12.003
2589-5540/Copyright ? 2018 Tianjin University. Publishing Service by Elsevier B.V. on behalf of KeAi Communications Co., Ltd. This is an open access article under the CC BY-NC-ND license
(http://creativecommons.org/licenses/by-nc-nd/4.0/).
更新日期/Last Update: 2019-03-14