|本期目录/Table of Contents|

 材料特性对亲水性固结磨料研磨垫加工性能的影响(PDF)

《纳米技术与精密工程》[ISSN:1672-6030/CN:12-1351/O3]

期数:
2013年1期
页码:
51
栏目:
精密加工
出版日期:
2013-01-15

文章信息/Info

Title:
 Influence of Material Characteristics on Machining Performance of Hydrophilic Fixed Abrasive Pad
作者:
 朱永伟12 付杰1 居志兰1 唐晓骁1 李军1
 1.摇南京航空航天大学机电学院,南京210016;
2. 江苏省精密与微细制造技术重点实验室,南京210016
Author(s):
 Zhu Yongwei12 Fu Jie1 Ju Zhilan1 Tang Xiaoxiao1 Li Jun1
 1.College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing
210016, China; 2. Jiangsu Key Laboratory of Precision and Micro-Manufacturing Technology, Nanjing 210016, China
关键词:
 材料特性 固结磨料研磨垫 材料去除速率 表面粗糙度 自修正
Keywords:
 material characteristics fixed abrasive pad material removal rate surface roughnessself-conditioning
分类号:
-
DOI:
-
文献标识码:
A
摘要:
 为研究材料特性对亲水性固结磨料研磨垫的加工性能影响,本文研究了K9玻璃和硅片两种材料在不同加工
顺序下研磨过程中的声发射信号和摩擦系数特征,采用扫描电镜分析磨屑的尺寸与形态.结果表明:不同加工顺序下
工件的材料去除速率差别很大. 与直接研磨硅片相比,先研磨K9玻璃再研磨硅片,硅片的材料去除速率大幅下降;相
反,先研磨硅片再研磨K9玻璃,与直接研磨K9玻璃相比,K9玻璃的材料去除速率变化不大. 无论采用哪种加工顺序,
后研磨的工件表面粗糙度均比直接研磨的同种工件要大. 扫描电镜的分析表明,硅片的磨屑尺寸集中在600 nm~1.5
μm,磨屑大部分都棱角完整;而K9玻璃的磨屑尺寸集中在300 nm~500 nm左右,无明显棱角. 硅片磨屑较大的尺寸与
完整的棱角促进了研磨垫的自修正过程,所以硅片这类脆性较大的材料有利于研磨垫的自修正过程.
Abstract:
 To study the impact of material characteristics on the machining performance of hydrophilic
fixed abrasive pad (FAP), K9 optical glass and silicon wafers were chosen as the work-pieces to
explore the effect of machining sequence on the acoustic emission signal and friction coefficient during
lapping. Scanning electron microscope (SEM) was employed to analyze the size and morphology of
debris. Results show that material removal rate(MRR) varies greatly with the change of the machining
sequence. Compared with the direct lapping of silicon wafer, if the silicon wafer is lapped after the
lapping of a K9 glass work-piece, its MRR will greatly decrease. In contrast, the MRR of K9 glass is
almost the same no matter whether it is lapped directly or after the lapping of a silicon wafer. The
average surface roughness of both directly lapped silicon wafer and K9 glass is lower than that of work-
pieces which are lapped after the lapping of the other. The size of most silicon debris is about 600
nm—1.5 μm, with clear edge; while that of K9 glass is around 300 nm—500 nm, edgeless. The
greater size and clear edge of debris created during the lapping of silicon wafer are helpful for the self-
conditioning process of hydrophilic FAP. Therefore, brittle materials such as silicon are helpful for the
self-conditioning behavior of FAP.

参考文献/References

备注/Memo

备注/Memo:
更新日期/Last Update: 2013-02-22